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datashee t product structure : silicon integrated circuit this product has no designed protec tion against radioactive rays . 1/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 tsz22111 ? 14 ? 001 www.rohm.com gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic isolation BM60014FV-C general description the BM60014FV-C is a gate driver with an isolation voltage of 2500vrms, i/o delay time of 120ns, and minimum input pulse width of 70ns. it incorporates the fault signal output functions, under-voltage lockout (uvlo) function and miller clamp function. features ? providing galvanic isolation ? active miller clamping ? fault signal output function ? under-voltage lockout function ? aec-q100 qualified applications ? igbt gate driver ? mosfet gate driver key specifications ? isolation voltage: 2500vrms ? maximum gate drive voltage: 24v ? i/o delay time: 120ns(max) ? minimum input pulse width: 70ns(max) package w(typ) x d(typ) x h(max) ssop-b20w 6.50mm x 8.10mm x 2.01mm typical application circuits 1pin gnd1 nc nc vcc1 ina inb xflt nc nc gnd1 nc gnd2 nc vcc2 out mc nc nc gnd2 nc uvlo1 uvlo1 pulse generator uvlo2 s q r pre- driver + - figure 1. application circuits (igbt gate driver) 1pin gnd1 nc nc vcc1 ina inb xflt nc nc gnd1 nc gnd2 nc vcc2 out mc nc nc gnd2 nc uvlo1 uvlo1 pulse generator uvlo2 s q r pre- driver + - figure 2. application circu its (mosfet gate driver)
datasheet datasheet 2/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C recommended range of external constants pin name symbol recommended value unit min. typ. max. vcc1 c vcc1 0.1 1.0 - f vcc2 c vcc2 0.33 - - f pin configurations pin descriptions pin no. pin name function 1 nc no connection 2 gnd2 output-side ground pin 3 nc no connection 4 nc no connection 5 mc output pin for miller clamp 6 out output pin 7 vcc2 output-side power supply pin 8 nc no connection 9 gnd2 output-side ground pin 10 nc no connection 11 gnd1 input-side ground pin 12 nc no connection 13 nc no connection 14 vcc1 input-side power supply pin 15 ina control input pin a 16 inb control input pin b 17 xflt fault signal output pin 18 nc no connection 19 nc no connection 20 gnd1 input-side ground pin gnd1 n c 20 1 nc gnd2 19 2 nc 18 3 xflt nc 17 4 inb m c 16 5 in a ou t 15 6 v cc1 vcc 2 14 7 nc n c 8 nc g nd2 12 9 gnd1 n c 11 10 13 n c (top view)
datasheet datasheet 3/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C description of pins and cautions on layout of board 1) vcc1 (input-side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppr ess voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the vcc1 and the gnd1 pins. 2) gnd1 (input-side ground pin) the gnd1 pin is a ground pin on the input side. 3) vcc2 (output-side positive power supply pin) the vcc2 pin is a power supply pin on the output side. to reduce voltage fluctuations due to out pin output current, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4) gnd2 (output-side ground pin) the gnd2 pin is a ground pin on the output side. 5) ina, inb (control input terminal) the ina and inb pins are used to determine output logic. inb ina out h l l h h l l l l l h h 6) out (output pin) the out pin is used to drive the gate of a power device. 7) mc (output pin for miller clamp) the mc pin is for preventing the increase in gate voltage due to the miller current of the power device connected to the out pin. if the miller clamp function is not used, short-circuit the mc pin to the gnd2 pin. 8) xflt (fault signal output pin) the xflt pin is an open drain pin used to output a fault si gnal when a fault occurs (i.e., when the under-voltage lockout function (uvlo1) is activated). conditions xflt while in normal operation l when an fault occurs (when uvlo1 is activated) hi-z
datasheet datasheet 4/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C description of functions and examples of constant setting 1) miller clamp function when ina=l and out pin voltage < v mcon (typ 2v), the internal mosfet of the mc pin is turned on. ina mc internal mosfet of the mc pin l less than v mcon on h x off ina gate out t poffa t pona h l h l h l mc v mcon l hi-z figure 4. timing chart of miller clamp function vcc2 out + - mc logic gnd2 predriver predriver predriver figure 3. block diagram of miller clamp function. v mcon gate
datasheet datasheet 5/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C 2) under-voltage lockout (uvlo) function the BM60014FV-C incorporates the under-voltage lockout (uvlo) function both on the low and the high voltage sides. when the power supply voltage drops to the uvlo on voltage (low voltage side typ 3.4v, high voltage side voltage typ 9.5v), the out pin will output the ?l? si gnal. in addition, to prevent malfunct ions due to noises, a mask time of t uvlo1msk (typ 2.5s) and t uvlo2msk (typ 2.85s) are set on both the low and the high voltage sides. this ic does not have a function which feeds back t he high voltage side state to the low voltage side. a fter the high voltage side uvlo is released, the input signal will take effect from the time after the input signal switches. figure 5. input-side uvlo f unction operation timing chart ina out vcc1 h l xflt h l hi-z l figure 6. output-side uvlo f unction operation timing chart ina out vcc2 h l xflt h l hi-z l v uvlo1h v uvlo2h v uvlo2l hi-z
datasheet datasheet 6/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C 3 i/o condition table no. status input output v c c 1 v c c 2 i n b i n a o u t m c x f l t 1 vcc1uvlo uvlo x x x l l h 2 vcc2uvlo x uvlo x x l l l 3 inb active h x l l l 4 normal operation l input l l l l l 5 normal operation h input l h h hi-z l : vcc1 or vcc2 > uvlo, x:don't care 4) power supply startup / shutoff sequence ina out vcc2 h l h l v uvlo1h v uvlo2h hi-z vcc1 xflt l hi-z mc hi-z v uvlo1h v uvlo1l v uvlo1l l v uvlo2l v uvlo2l v uvlo2h figure 7. power supply startup / shutoff sequence : since the vcc2 to gnd2 pin voltage is lo w and the output mos does not turn on, the output pins become hi-z.
datasheet datasheet 7/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C absolute maximum ratings (note 1) relative to gnd1. (note 2) relative to gnd2. (note 3) should not exceed pd and tj=150c (note 4) derate by 9.5mw/c when operating above ta=25c. mounted on a glass epoxy of 70mm 70mm 1.6mm. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating ratings parameter symbol min. max. units input-side supply voltage v cc1 (note 5) 4.5 5.5 v cc1 (note 5) output-side supply voltage v cc2 (note 6) 10 24 v cc2 (note 6) (note 5) relative to gnd1. (note 6) relative to gnd2. insulation related characteristics parameter symbol characteristic units insulation resistance (v io =500v) r s >10 9 ? insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limits unit input-side supply voltage v cc1 -0.3 +7.0 (note 1) v output-side supply voltage v cc2 -0.3 +30.0 (note 2) v ina pin input voltage v ina -0.3 +vcc1+0.3 or +7.0 (note 3) v inb pin input voltage v inb -0.3 +vcc1+0.3 or +7.0 (note1) v out pin output current (peak 10s) i outpeak 5.0 (note 3) a xflt pin output current i xflt 10 ma power dissipation pd 1.19 (note 4) w operating temperat ure range topr -40 +125 c storage temperature range tstg -55 +150 c junction temperature tjmax +150 c
datasheet datasheet 8/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C electrical characteristics unless otherwise specified t a =-40c to 125c, v cc1 =4.5v to 5.5v, v cc2 =10v to 24v parameter symbol min. typ. max. unit conditions general input side circuit current 1 i cc11 0.06 0.14 0.22 ma input side circuit current 2 i cc12 0.10 0.20 0.30 ma ina =10khz, duty=50% input side circuit current 3 i cc13 0.15 0.30 0.45 ma ina =20khz, duty=50% output side circuit current 1 i cc21 0.26 0.44 0.62 ma out=l output side circuit current 2 i cc22 0.22 0.38 0.57 ma out=h logic block logic high level input voltage v inh 2.0 - v cc1 v ina, inb logic low level input voltage v inl 0 - 0.8 v ina, inb logic pull-down resistance r ind 25 50 100 k ? ina, inb logic input minimum pulse width t inmin - - 70 ns ina, inb output out on resistance (source) r onh 0.4 0.9 2.0 ? i out =-40ma out on resistance (sink) r onl 0.2 0.6 1.3 ? i out =40ma out maximum current (source) i outmaxh 3.0 4.5 - a vcc2=15v, guaranteed by design out maximum current (sink) i outmaxl 3.0 3.9 - a vcc2=15v, guaranteed by design turn on time t pona 70 90 120 ns ina=pwm, inb=l t ponb 65 85 115 ns ina=h, inb=pwm turn off time t poffa 70 90 120 ns ina=pwm, inb=l t poffb 75 95 125 ns ina=h, inb=pwm propagation distortion t pdista -25 0 25 ns t poffa ? t pona t pdistb -15 10 35 ns t poffb ? t ponb rise time t rise - 50 - ns 10nf between out-gnd2 fall time t fall - 50 - ns 10nf between out-gnd2 mc on resistance r onmc 0.20 0.65 1.40 ? i mc =40ma mc on threshold voltage v mcon 1.8 2 2.2 v common mode transient immunity cm 100 - - kv/s guaranteed by design protection functions vcc1 uvlo off voltage v uvlo1h 3.35 3.50 3.65 v vcc1 uvlo on voltage v uvlo1l 3.25 3.40 3.55 v vcc1 uvlo mask time t uvlo1msk 1.0 2.5 5.0 s vcc2 uvlo off voltage v uvlo2h 9.0 9.5 10.0 v vcc2 uvlo on voltage v uvlo2l 8.0 8.5 9.0 v vcc2 uvlo mask time t uvlo2msk 1.00 2.85 5.00 s xflt output l voltage v xflt - 0.10 0.25 v i xflt =5ma ina out t rise t fall t pona t poffa 50% 50% 90% 50% 50% 90% 10% 10% figure 8. in-out timing chart
datasheet datasheet 9/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc11 [ma] 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 -40-20 0 20406080100120 ta [c] icc11 [ma] 0.10 0.14 0.18 0.22 0.26 0.30 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc12 [ma] 0.10 0.14 0.18 0.22 0.26 0.30 -40-20 0 20406080100120 ta [c] icc12 [ma] figure 9. input side circuit current vs input side supply voltage figure 10. inpu t side circuit current vs temperature ta = - 4 0 c ta = 2 5 c ta=125 c vcc1=5.0v ta = - 4 0 c ta = 2 5 c ta=125 c vcc1=4.5v vcc1=5.5v vcc1=5.0v vcc1=4.5v vcc1=5.5v figure 11. input side circuit current vs input side supply voltage (at ina=10khz, duty=50%) figure 12. input side circuit current vs temperature (at ina=10khz, duty=50%)
datasheet datasheet 10/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued 0.15 0.20 0.25 0.30 0.35 0.40 0.45 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc13 [ma] 0.15 0.20 0.25 0.30 0.35 0.40 0.45 -40-20 0 20406080100120 ta [c] icc13 [ma] 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 10 12 14 16 18 20 22 24 vcc2 [v] icc21 [ma] 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 -40-20 0 20406080100120 ta [c] icc21 [ma] figure 15. output side circuit current vs output side supply voltage (at out=l) figure 16. output side circuit current vs temperature (at out=l) figure 13. input side circuit current vs input side supply voltage (ina=20khz, duty=50%) figure 14. input side circuit current vs temperature (ina=20khz, duty=50%) ta=-40c ta=25c ta=125c vcc1=5.0v vcc1=4.5v vcc1=5.5v ta=-40c ta=25c ta=125c vcc2=15v vcc2=10v vcc2=24v
datasheet datasheet 11/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued figure 17. output side circuit current vs output side supply voltage (at out=h) figure 18. output side circuit current vs temperature (at out=h) 0.22 0.27 0.32 0.37 0.42 0.47 0.52 0.57 10 12 14 16 18 20 22 24 vcc2 [v] ic c22 [m a] 0.22 0.27 0.32 0.37 0.42 0.47 0.52 0.57 -40 -20 0 20 40 60 80 100 120 ta [c] ic c22 [m a] figure 19. logic (ina/inb) high/low level voltage vs input side supply voltage figure 20. out vs logic (ina) input voltage (vcc1=5v, vcc2=15v, ta=25 c) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] vinh / vinl [v] 0 4 8 12 16 20 24 012345 ina [v] out [v] vcc1=5v ta = - 4 0 c ta = 2 5 c ta=125 c vcc2=15v vcc2=10v vcc2=24v ta = - 4 0 c ta = 2 5 c ta=125 c ta = - 4 0 c ta = 2 5 c ta=125 c h level l level
datasheet datasheet 12/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued figure 21. logic pull-down resistance vs temperature figure 22. logic (ina) input minimum pulse width vs temperature 0 25 50 75 100 -40-20 0 20406080100120 ta [c] rind [k ? ] 0 20 40 60 80 100 -40-20 0 20406080100120 ta [c] tinmin [ns] figure 23. out on resistance (source) vs temperature 0.4 0.8 1.2 1.6 2.0 -40 -20 0 20 40 60 80 100 120 ta [c] ronh [ ? ] figure 24. out on resistance (sink) vs temperature 0.2 0.4 0.6 0.8 1.0 1.2 -40 -20 0 20 40 60 80 100 120 ta [c] ronl [ ? ] vcc1=4.5v vcc1=5.0v vcc1=5.5v vcc1=4.5v vcc1=5.0v vcc1=5.5v vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v
datasheet datasheet 13/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued figure 25. turn on time vs temperature (ina=pwm, inb=l) figure 26. turn off time vs temperature (ina=pwm, inb=l) 70 80 90 100 110 120 -40-20 0 20406080100120 ta [c] tpona [ns] 70 80 90 100 110 120 -40-20 0 20406080100120 ta [c] tpoffa [ns] vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v figure 27. turn on time vs temperature (ina=h, inb=pwm) figure 28. turn off time vs temperature (ina=h, inb=pwm) 70 80 90 100 110 120 -40-20 0 20406080100120 ta [c] tponb [ns] 70 80 90 100 110 120 -40-20 0 20406080100120 ta [c] tpoffb [ns] vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v
datasheet datasheet 14/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued figure 29. rise time vs output side supply voltage (10nf between out-gnd2) figure 30. fall time vs output side supply voltage (10nf between out-gnd2) 25 50 75 100 10 14 18 22 vcc2 [v] trise [ns] 25 50 75 100 10 14 18 22 vcc2 [v] tfall [ns] ta = - 4 0 c ta = 2 5 c ta=125 c ta = - 4 0 c ta = 2 5 c ta = 1 2 5 c figure 31. mc on resistance vs temperature figure 32. mc on threshold voltage vs temperature 0.4 0.8 1.2 1.6 2.0 -40 -20 0 20 40 60 80 100 120 ta [c] ronh [ ? ] vcc2=10v vcc2=15v vcc2=24v 1.8 1.9 2.0 2.1 2.2 -40-20 0 20406080100120 ta [c] vmcon [v] vcc2=10v vcc2=15v vcc2=24v
datasheet datasheet 15/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued 8.0 8.5 9.0 9.5 10.0 -40-20 0 20406080100120 ta [c] vuvlo2h/l [v] 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 -40-20 0 20406080100120 ta [c] vuvlo1h/l [v] figure 33. input side uvlo on/off voltage vs temperature figure 34. input side uvlo mask time vs temperature vuvlo1h vuvlo1l figure 35. output side uvlo on/off voltage vs temperature figure 36. output side uvlo mask time vs temperature 0 1 2 3 4 5 -40 -20 0 20 4 0 60 80 100 120 ta [c ] tuvlo2msk [us] vuvlo2h vuvlo2l 0 1 2 3 4 5 -40 -20 0 20 4 0 60 80 100 120 ta [c ] tuvlo1msk [s]
datasheet datasheet 16/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C typical performance curves - continued figure 37. output low voltage vs input side supply voltage (ixflt=5ma) 0.0 0.1 0.2 0.3 0.4 4.50 4.75 5.00 5.25 5.50 vcc1 [v] vxflt [v] ta = - 4 0 c ta = 2 5 c ta=125 c
datasheet datasheet 17/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C selection of components externally connected figure 38. for driving igbt figure 39. for driving igbt with buffer circuits figure 40. for driving igbt with negative power supply gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver figure 41. for driving igbt with buffer circuits & negative power supply recommended rohm mcr03ezp gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver recommended rohm mcr03ezp gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver recommended rohm mcr03ezp gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver recommended rohm mcr03ezp recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr100ezp recommended rohm mcr100ezp recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm mcr100ezp
datasheet datasheet 18/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C figure 42. for driving mosfet figure 43. for driving mosfet with buffer circuits figure 44. for driving mosfet with negative power supply gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver figure 45. for driving mosfet with buffer circuits & negative power supply recommended rohm mcr03ezp gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver recommended rohm mcr03ezp recommended rohm mcr03ezp gnd1 nc gnd1 nc nc xflt inb ina vcc1 nc uvlo1 uvlo1 pulse generator uvlo2 s q r + - nc gnd2 nc vcc2 out mc nc nc gnd2 nc 1pin pre- driver recommended rohm mcr03ezp recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr100ezp recommended rohm mcr100ezp recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm mcr100ezp
datasheet datasheet 19/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C power dissipation thermal design please make sure that the ic?s chip temperature tj is not over 150c, while considering the ic?s power consumption (w), package power (pd) and ambient temperat ure (ta). when tj=150c is exceeded, th e function as a semiconductor will not operate and some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) occur. constant use under these circumstances leads to deterioration and eventually ic may destruct. tjmax=150c must be strictly followed under all circumstances. figure 46. ssop-b20w derating curve 0 25 50 75 100 125 150 0 0.5 1.0 1.5 1.19 w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 a mbient temperature: ta[c] power dissipation:pd [w] measurement machine th156 kuwano electric measurement condition rohm board board size 70 70 1.6mm 3 1-layer board ja =105.3c/w
datasheet datasheet 20/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C i/o equivalent circuits pin no name i/o equivalence circuits function 1 out out gnd2 vc c 2 output pin 2 mc mc gnd2 vc c 2 output pin for miller clamp 3 ina ina inb gnd1 vc c 1 control input pin a inb control input pin b 4 xflt xfl t gnd1 fault signal output pin
datasheet datasheet 21/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximu m rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet datasheet 22/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C operational notes ? continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 47. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso).
datasheet datasheet 23/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C ordering information b m 6 0 0 1 4 f v - ce 2 part number package fv:ssop-b20w packaging and forming specification c:automotive packaging and forming specification e2: embossed tape and reel marking diagrams ssop-b20w(top view) bm60014 part number marking lot numbe r 1pin mark
datasheet datasheet 24/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C physical dimension, tape and reel information package name ssop-b20w ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
datasheet datasheet 25/25 tsz02201-0p5p0bh00010-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.nov.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60014FV-C revision history date revision changes 25.nov.2013 001 new release
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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